OMAC Demonstrates Packaging Guidelines in Action at PACK EXPO International 2006

16 Oct 2006

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OMAC Packaging Workgroup seeks to maximize end-user and OEM machine automation choices plus expand and enhance the "connect-and-pack" guidelines.

16/10/06 OMAC Packaging Working Group (OPW) will highlight the business value of implementing their industry automation guidelines on packaging machinery at the upcoming PACK EXPO International being held at McCormick Place in Chicago, Illinois, from 29 October - 2 November 2006. This industry wide event will host more than 2,000 packaging and processing exhibitors from around the globe.

Located at booth C-64 (Grand Concourse), seven operating demonstration units implementing OPW guidelines from 17 diverse hardware and software suppliers will be showcased. Five machine builders (ADCO, Douglas Machine, Markem, Pneumatic Scale, RA Jones) and seventeen technology suppliers (AMK, B&R, Baldor, Baumuller, Beckhoff, Bosch Rexroth, Danfoss, Elau, Lenze, Lust, Parker Hannifin, Rockwell Automation, SEW, Siemens, Wago, Wonderware, Yaskawa) are sponsors of the OPW Booth.

Dave Bauman, OMAC Technical Director said, "OMAC is very pleased with the range of companies participating in the demonstration units in the OPW Booth. They highlight the broad support that the OPW guidelines are receiving in the industry. Machine builders and users can realize immediate cost savings and productivity improvements using these guidelines."

The OMAC Packaging Workgroup will also host a general user meeting during PackExpo on Tuesday, October 31st at 3 PM in Room 103D of the South Building in McCormick Place. Anyone interested in learning more about the business benefits of the OPW guidelines is encouraged to attend.

OMAC Packaging Workgroup seeks to maximize end-user and OEM machine automation choices plus expand and enhance the "connect-and-pack" guidelines to provide easier integration horizontally (process to packaging) and vertically (packaging to ERP systems). Using the guidelines will increase flexibility, facilitate a smaller footprint machine, achieve faster throughput, and reduce costs through greater industry openness and interoperability. This will allow end users to "connect-and-pack" different technology solutions to meet their business needs.

To attain this goal, the five Packaging sub-groups - PackSoft, PackConnect, PackAdvantage, PackML, and PackLearn - work with automation suppliers, OEMs, and trade groups worldwide to encourage support of the "connect-and-pack" guidelines throughout their products and practices, creating a mutually beneficial environment for the guidelines.