Hi & Fi Asia-China 2020

Duration:25 Nov 2020 - 27 Nov 2020
Event:Hi & Fi Asia-China 2020
Location:Shanghai, China
Organizer:UBM EMEA
Email: Fi@cmpinformation.com
Website: https://www.figlobal.com/china/en/home.html
Event Details:

Hi & Fi Asia-China 2019 successfully brought together over 1,800 exhibitors and 74,000 visitors. At five combined shows, including HNC, ProPak China & FoodPack, as well as Starch Expo, attendees were able to source solutions from our extensive offering of health ingredients, food ingredients, nutraceuticals, natural ingredients, starch ingredients and packaging and processing solutions.

Hi & Fi Asia-China was hosted at a new venue in Shanghai, the NECC, covering 140,000 m2, which was very well received by attendees. The event is set to return again in 2020.

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